What should be done with layout tape before chamfering holes in an assembly?

Before chamfering holes in an assembly, it is essential to remove the layout tape. Layout tape is often used to mark precise locations for drilling or other operations, providing a visual reference during the assembly process. However, when preparing to chamfer holes, the presence of the tape can interfere with the machining process. The chamfering operation requires clear access to the edges of the hole to achieve the correct angle and finish.

By removing the layout tape, the mechanic ensures that there are no obstructions when expanding or reshaping the hole, allowing for a clean chamfer. Additionally, removing the tape helps prevent any adhesive residue from affecting the final part’s surface finish or integrity. This practice supports both accuracy and quality in the assembly process, which are critical in aerospace applications where precision is paramount.